Very low profile high-temperature ductility ultra-thick electrolytic copper foil has excellent physical properties such as equiaxed fine grains, low profile, high strength and high elongation

This product is suitable for automobile, electric power, communication, military industry, aerospace and other high-power circuit board, high-frequency board manufacturing, with fine crystal, low profile, high elongation and other excellent physical properties; In the process of PCB production, it has the advantages of short etching time and uniform etching.

this product is suitable for automobile, electric power, communication, military, aerospace and other high-power circuit boards, high-frequency board manufacturing, with fine grain, low profile, high elongation and other excellent physical properties; In the process of circuit board production, it has the advantages of short line etching time, uniform line etching and so on.

Very low profile electrolytic copper foil

This product is suitable for the manufacture of high-power circuit boards and high-frequency boards for automobiles, electric power, telecommunications, military, aerospace, etc. It has excellent physical properties such as fine crystal, low profile and high elongation; it has line etching in the production process of circuit boards. Short time, even line etching and so on.

Main applications: transformers, cables, mobile phones, computers, medical, aerospace, military and other electronic products shielding. It has good moisture resistance, chemical resistance and ultraviolet linearity, which is suitable for preventing interference with static electricity and restraining electromagnetic wave.